Interactions in metal-liquid metal interfaces: Interaction of advanced high-temperature solders with metallic and non-metallic holders

Acronym:	INTERMETAL
Project start:	01.09.2008
Project end:	31.12.2010
Programme:	APVV
Project number:	APVV-0102-07
Institute position in the project:	Partner
Project leader at the institute:	Pavol Šebo

The project was focused on enhancement of knowledge about the interactions at metal-liquid metal interfaces by simultaneous exploitations of experimental and first-principle methods. The emphasis was given on determination of suitable new high-temperature lead-free solder alloy compositions, which would contribute to the knowledge in the field of soldering, especially on alloys with increased melting temperatures, e.g antimony-silver and tin-antimony, alloyed with elements influencing physical, thermodynamic and technical properties (wetting, reliability, etc.) in combination with Cu and Ni substrates, for strength and reliability of joints produced by such substrates and solder (In,Cu,Ni,Ge,Ga,…).The results obtained by synergic experimental research and first-principle predictions of phase diagrams and physical properties of solder alloy systems will target, besides new knowledge, a formation of a broader set of materials with well determined properties and (technological) procedures, including a tunable interval of soldering temperatures and enhancement of reliability of soldered joints. Progress in understanding of structures, properties and interactions in molten alloys and at their interfaces at temperatures well below the typical „metallurgical“ temperatures (above 1000°C) is expected. The investigated systems represent ideal experimental and theoretical material basis for investigations of these phenomena with a realistic possibility of extrapolation of results also to elevated temperatures.